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XCVM1302-2MSIVSVD1760

XCVM1302-2MSIVSVD1760
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Features
Specifications
Category: Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status: Active
Peripherals: DDR, DMA, PCIe
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Series: Versal™ Prime
Package: Tray
Mfr: AMD
Supplier Device Package: 1760-FCBGA (40x40)
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature: -40°C ~ 100°C (TJ)
Architecture: MPU, FPGA
Package / Case: 1760-BFBGA, FCBGA
Number Of I/O: 402
RAM Size: -
Speed: 600MHz, 1.4GHz
Core Processor: Dual ARM® Cortex®-A72 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5F With CoreSight™
Flash Size: -
Basic Infomation
Payment & Shipping Terms
Stock: In Stock
Shipping Method: LCL, AIR, FCL, Express
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Product Description
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 600MHz, 1.4GHz 1760-FCBGA (40x40)
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Contact Person : Jack
Tel : +8618098974141
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