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XCVM1302-2LSENSVF1369

XCVM1302-2LSENSVF1369
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Features
Specifications
Category: Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status: Active
Peripherals: DDR, DMA, PCIe
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Series: Versal™ Prime
Package: Tray
Mfr: AMD
Supplier Device Package: 1369-BGA (35x35)
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature: 0°C ~ 100°C (TJ)
Architecture: MPU, FPGA
Package / Case: 1369-BFBGA
Number Of I/O: 316
RAM Size: -
Speed: 450MHz, 1.08GHz
Core Processor: Dual ARM® Cortex®-A72 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5F With CoreSight™
Flash Size: -
Basic Infomation
Payment & Shipping Terms
Stock: In Stock
Shipping Method: LCL, AIR, FCL, Express
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Product Description
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 450MHz, 1.08GHz 1369-BGA (35x35)
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Tel : +8618098974141
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